Highlight
- iQOO 13 is expected to be launched by November in China
- The iQOO 13 is expected to come with heat dissipation architecture with a single-layer motherboard
iQOO 13 is expected to be launched by November in China and might follow with a handset debut in India by December. The leaks and rumors of the specs and features of this smartphone have been swirling over the internet. A new leaks suggest that the iQOO 13 might come with et a new chip and heat dissipation system with a single-layer motherboard.
iQOO 13 to Features Advanced Cooling and Powerful Q2 Chip
The tipsters on Weibo who are familiar with this matter claim that the iQOO 13 will come with a new heat dissipation architecture with a single-layer motherboard for thermal management. The iQOO 13 is also said to feature a new VC heat sink as well (machine translated from Chinese).
Also Read: iQOO TWS 1e finally Launched in India: Check Price and feature in India
The same users in a separate post on Weibo that the iQOO 13 will feature the new Q2 chip for gaming developed by the company. It is important to note that the iQOO 12 and iQOO Neo 9 series pack Supercomputing Chip Q1 is capable of a 144fps (frames per second) gaming experience.
The iQOO 13 is expected to come into the Indian market between December 1 and December 10, after it officially launched in China expected by November. Its expected price is Rs 55,000 in India.
